Efficient nanoscale characterization of wafer surfaces using intelligent sampling and Bayesian optimization

Abstract

The geometrical attributes of a wafer, such as thickness, uniformity, and local curvature, serve as eminent determinants of its quality. Therefore, measurements that are both rapid and accurate are paramount as multi-stage fabrication processes hinge on them to ensure high product reliability, proper process control, and maximum efficiency. The manual wafer profiling measurement approach in use today is, unfortunately, a time-consuming process. This creates a need for fast and prompt analysis of wafer attributes. This research thus proposes an iterative sampling method that boasts reducing the number of samplings down to a minimum without the need to discard a sufficient level of accuracy for the purpose of reliable attribute estimation. Subsequently, we suggest a series of methods to improve the monitoring and evaluation of the surface topography, all within the context of ultra-precision/nanoscale manufacturing processes, such as ultra-precision machining (UPM) and chemical–mechanical planarization (CMP). For the purpose of both real-time and exception-based detection of anomalies in the UPM process, we constructed a process-machine interaction (PMI) model with Bayesian learning, which amalgamates the received data across heterogeneous sensors such as force, vibration, and acoustic emission in situ. Similarly, the CMP process is quantitatively characterized by a multi-scaled multilayer nonlinear decomposition model with predictive capabilities. This model helps understand the physio-mechanical phenomena underlying both CMP and the UPM processes and describe and predict the nonlinear interactions, as evidenced by the experimentally collected vibration signal patterns.