Abstract
We demonstrate the use of a novel efficient metallic susceptor for generating controllable and rapid localized heating for low-cost substrate bonding using commercial microwave ovens. A microwave oven is modeled and enhanced microwave susceptors are designed. Theoretical analysis and simulations confirm our proposed concept and match with our measured data. It is demonstrated that by the use of proposed susceptors, a polymethyl methacrylate substrate can be heated up to 160 °C in less than 8 s. We have also demonstrated that the heat generation is localized and selective, making this technique promising for microfluidic or substrate bonding applications.
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