Efficient manufacture of high-performance electroplated diamond wires utilizing Cr-coated diamond micro-powder

Abstract

The slicing of silicon ingots using electroplated diamond wires is a fundamental process in the creation of semiconductor devices such as chips and photovoltaic cells. Composite electroplating, a process that uses nickel (Ni) plating to fix diamond particles onto a steel wire, is a critical step in the manufacturing of these diamond wires. In this work, chromium (Cr)-coated diamond was used to achieve rapid and high-quality composite electroplating, thereby aiding the production of high-performance diamond wire saws. The Cr-coated diamond micro-powder was prepared utilizing vacuum slow evaporation technology at a temperature of 850 °C. This resulted in a uniform and firm Cr coating that was firmly bonded to the diamond surface via Cr3C2. Subsequent electrochemical tests were conducted in the composite electroplating bath. Linear scanning voltammetric curves revealed that the Cr-coated diamond was capable of inducing a more positive shift in the overpotential of Ni deposition, thus enhancing the reaction beyond that of uncoated diamond micro-powder. Additionally, the electrochemical impedance spectra indicated a decrease in charge transfer resistance during composite electroplating, attributable to the conductivity of the Cr-coated diamond. Electroplated diamond wires incorporating Cr-coated diamond demonstrated a greater abrasive density per unit length. SEM results showed that Ni was able to deposit on the Cr-coated diamond surface, resulting in the abrasives being completely covered by the Ni plating. The Cr-coated diamond wire exhibits a stronger resistance to abrasive detachment after cutting, which could increase the diamond-protrusion of the wire. The utilization of Cr-coated diamond micro-powder as an abrasive is anticipated to enhance the manufacturing efficiency of diamond wires and improve product quality, thereby promoting advancements in hard and brittle material processing technology.