Abstract

With the increase in the complexity of the semiconductor device processes and increase in the challenge to satisfy high market demands, enhancement in yield has become a crucial factor. Discovering and reacting to yield problems emerging at the end of the production line may cause unbearable yield loss leading to larger times to market. Thus, time and cost involved in fault isolation may be significantly shortened by effectively utilizing the fault diagnosis technology and supporting yield improvements. Hence for yield analysis, a highly integrated data network with software analysis tools have been established to reduce the fault analysis time. Synopsys Avalon, a product used for fault localization is described in this paper which aids in achieving better integrated circuit yields. This paper also illustrates various fault localization techniques for faster problem identification and discusses a few analytical tools like photon emission microscope and transmission emission microscope for faster determination of device failures.

Highlights

  • IntroductionEstimation of yield and faster yield ramp are crucial in integrated circuit (IC) manufacturing cycle

  • Estimation of yield and faster yield ramp are crucial in integrated circuit (IC) manufacturing cycle.With new technologies introduced and fabricated, the yields observed could be as low as 20% of the production [1]

  • Failure analysis is the process of collecting and analyzing data to determine the cause of a failure, often with the goal of determining corrective actions or liability

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Summary

Introduction

Estimation of yield and faster yield ramp are crucial in integrated circuit (IC) manufacturing cycle. Electronics 2018, 7, 28 overall yield of large scale integrated circuits as previously been attempted by analyzing the memory. The yield importance of is performing circuit analyses failures. Analysis (FA) is a process identify thetechniques root causetoof localize the faulty block with high accuracy, enabling them to identify the causes of yieldto failures. The FA engineers use various effective fault identification and localization techniques degradations over short identification is a tedious andthe time-consuming process. With highFailure accuracy, enabling them to identify causes of yield degradations efficient, accurate and fast analysis tool is intuitively essential to reduce. Techniques, including a technique for for identifying the the faultfault sites sites efficiently assessing theand cause from thefordiagnosis results andsites selecting samples to be without physicalbyfailure analysis a technique identifying the fault efficiently by assessing subjected failure [13].

Section 5.
Methods of Fault Identification and Localization for Yield Improvement
Compact
Case Study 1
Case Study 2
19. Synopsys
Wafer Navigation
Random
Use Flows of Physical Failure Analysis
24. Use flow
Findings
Conclusions
Full Text
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