Abstract
The effects of Y2O3 nanoparticles doped in Sn-3Ag-0.5Cu solder on the growth behaviors of Cu6Sn5 grains in the soldering reaction with copper were investigated. It is found that the growth rate of Cu6Sn5 grains was markedly decreased due to the addition of Y2O3 nanoparticles. The statistical size distribution results indicated that Cu6Sn5 grains with radius less than the average value account for a high percentage. These results confirm that the nanoparticles can effectively suppress the diffusion behaviors of Cu atoms in the wetting reaction.
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