Effects of working temperature and fluid physical properties on heat transfer enhancement in conduction pumping: An experimental study

Abstract

In the current study, heat transfer behavior in electrohydrodynamic conduction pumping of two different dielectric liquid films using flush electrodes has been experimentally studied, and effects of working temperature and fluid physical properties on heat transfer enhancement are investigated. The study is conducted for different liquid film thicknesses and working temperatures, while changing the magnitude of the applied electrical voltage. Results show that higher ion mobility difference and working temperature of the dielectric liquid, as well as lower density and viscosity increase flow rate and heat transfer of the pump. Also, it is seen that heat transfer coefficient is intensively enhanced for all different film thicknesses and working temperatures by using the conduction pump, which is due to the turbulent flow created in the vicinity of the electrodes. For 8 mm film thickness of n-hexane at35°C, the significant enhancement of heat transfer coefficient equal to 1040.9% was observed.