Abstract
When sectioning both brittle and ductile materials, often no consideration is given to the proper selection of a wafering blade. This step in specimen preparation is potentially the most damage inducing stage in specimen preparation. Selection of a proper blade should be carefully considered so that the induced anomalies or damage do not confound the analysis. The paper describes the effects of the three important parameters bonding, grit size and concentration and shows some examples of application. In general, smaller grit sizes reduce damage; lower abrasive concentrations increase removal rates for brittle materials.
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