Abstract
Reliability of electronic packages has become a major issue, particularly in systems used in electrical or hybrid cars where severe operating conditions must be met. Many studies have shown that solder interconnects are critical elements since many failure mechanisms originate from their typical response under thermal cycles. In this study, effects of voids in solder interconnects on the electronic assembly lifetime are estimated based on finite element simulations.
Highlights
Pre-existing voids in solder joints are generated during the manufacturing process and can be classified into various categories
Many studies have shown that solder interconnects are critical elements since many failure mechanisms originate from their typical response under thermal cycles
Effects of voids in solder interconnects on the electronic assembly lifetime are estimated based on finite element simulations
Summary
Pre-existing voids in solder joints are generated during the manufacturing process and can be classified into various categories. We will focus here on macrovoids which are caused by nonuniform solder shrinkage or by entrapped air due to outgassing during the reflow process. Many conflicting results have been reported regarding the effects of voids on damage in the solder material [1]. The main objective of this study is to investigate separately the effects of void size and location on lifetime of the solder joint. The electronic assembly (Fig. 1a), whose reliability is investigated under thermal cycling, contains lead-free solder interconnections (SAC). Inspection with X-ray tomography (Fig. 1b) reveals that voids are mostly prevalent in the lower solder layer
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