Abstract

This work describes various combinations of cleaning methods involved in the preparation of Ni-5% W substrates for the deposition of buffer layers using water-based solvents. The substrate has been studied for its surface properties using X-ray photoelectron spectroscopy (XPS). The contaminants in the substrates have been quantified and the appropriate cleaning method was chosen in terms of contaminants level and showing good surface crystallinity to further consider them for depositing chemical solution-based buffer layers for Y1Ba2Cu3Oy (YBCO) coated conductors.

Highlights

  • Second generation superconductors employing RABiTS (Rolling-Assisted-Biaxially-Textured-Substrates) offer a viable way to develop superconductor wires for commercial use

  • The crucial factor to Nanomaterials 2012, 2 obtain a superconducting YBCO thin film is dependent on the ability to deposit smooth, dense, crack-free and highly aligned oxide buffer layers on textured metal substrates to protect the superconductors from metal contamination and, to provide an appropriate biaxially oriented, lattice matched substrate for the subsequent epitaxial growth of superconducting YBCO on top of it

  • Our work was focused on depositing water based buffer layers using chemical solution deposition method (CSD) on the Ni-5% W substrates

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Summary

Introduction

Second generation superconductors employing RABiTS (Rolling-Assisted-Biaxially-Textured-Substrates) offer a viable way to develop superconductor wires for commercial use. The crucial factor to Nanomaterials 2012, 2 obtain a superconducting YBCO thin film is dependent on the ability to deposit smooth, dense, crack-free and highly aligned oxide buffer layers on textured metal substrates to protect the superconductors from metal contamination and, to provide an appropriate biaxially oriented, lattice matched substrate for the subsequent epitaxial growth of superconducting YBCO on top of it. Such a barrier layer may limit diffusion as well from the metal substrate to the superconducting coating as inversely, thereby allowing a better control of purity and oxygen content. It was found that the cleaning treatment significantly improves the wettability of the substrates, a crucial property for the epitaxial growth of crack-free and homogeneous buffer layers by means of water-based solution-gel deposition techniques

Chemical Cleaning with Etching Process
Thermal Cleaning Process
XPS Characterization
Results and Discussion
Chemical Cleaning with Etching for 15 min
Thermal Cleaning
Thermal Cleaning Followed by Chemical Cleaning with Etching for 15 min
Chemical Cleaning with Etching for 15 min Followed by Thermal Cleaning
RHEED Analysis
Conclusions
Full Text
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