Abstract
The effects of ultraviolet (UV) radiation on ultra-low-kdielectric (ULK) thin film fracture toughness were studied. This work discusses both critical and subcritical crack growth behavior under different environments. The critical fracture toughness was measured as a function of applied phase angle by using the four-point bend flexure and mixed-mode double cantilever beam techniques. Results of critical fracture toughness obtained under different loading configurations and phase angles were found to increase with the UV treatment time. In contrast, mode I subcritical fracture toughness thresholds and the crack propagation velocity appeared to be insensitive to UV curing processes. This study revealed that subcritical fracture toughness values reduced with the moisture concentration in the environment.
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