Effects of typical soybean meal type on the properties of soybean-based adhesive

Abstract

In order to effectively apply soybean meal for the preparation of water-resistant soybean-based adhesives for plywood, the effects of three typical soybean meal products, namely, low-temperature soybean meal (LM), high-temperature soybean meal (HM), and physical soybean meal (PM), on the properties of soybean-based adhesive were investigated. The results indicated that the number of reactive groups in the three soybean meals followed the order LM > HM > PM, which in turn led to various crosslinking densities when these soybean meals were crosslinked by epichlorohydrin-modified polyamide (EMPA) during the curing process. The LM soybean adhesive had 6.6% higher soaking bond strength and 16.5% higher boiling-dry-boiling bond strength than the HM soybean adhesive, and 19% higher soaking bond strength and 33% higher boiling-dry-boiling bond strength than the PM soybean adhesive, respectively. These three soybean meals could be used to prepare soybean adhesives for interior-use plywood because all plywood panels bonded with their adhesives passed a water-soaking test at 63 °C for 3 h, but only the LM soybean adhesive achieved the desired water resistance for floor-base plywood. Among the three evaluated soybean meals, LM was the most promising raw material for the preparation of soybean-based adhesive because of a greater number of reactive groups, higher crosslinking density, and superior bond strength. Plywood panel bonded with HM soybean adhesive had a water resistance lower than, but very close to, the standard required value (>0.8 MPa) for floor-base plywood.