Abstract
A relationship between interfacial bond strength and electrical conductivity of the transition zone has been developed. Microstructural factors affecting the bond strength of a non-porous aggregate-portland cement paste interface are elucidated. The results indicate that two principal factors affect the interfacial bond strength, i.e. the thickness of the water layer on the aggregate surface at the beginning of the mixing and w/c ratio. Decreasing the thickness of the water layer and w/c ratio are two methods to increase the bond strength.
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