Abstract
This study investigated the effects of adding titanium dioxide (TiO2) and aluminium oxide (Al2O3) nanoparticles into Sn3.0Ag0.5Cu (SAC) lead-free solder alloy on the thermal properties and wettability. In comparison with SAC lead-free solder without addition of nanoparticles, the melting temperature is very similar and comparable. The solidus temperature is in the range of 217.1 to 217.2 °C with the addition of TiO2 and Al2O3 nanoparticles. The results shows that the addition of 0.25-1.0 wt% of TiO2 and Al2O3 nanoparticles caused the liquidus temperature to decrease from 222.4 to 220.5 °C. The spreading area of SAC-xTiO2-xAl2O3 lead-free solder increases from 5.7 to 7.1mm at 0-0.5wt% of TiO2 and Al2O3 nanoparticles. The contact angle decreased from 66.09° to 46.84° when the composition of TiO2 and Al2O3 increases from 0-0.5wt%.
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