Effects of Ti content on the wetting behavior and chemical reaction in AgCuTi/SiO2 system

Abstract

Effect of Ti Content on the wetting behavior and chemical reaction in AgCuTi/SiO2 system are studied. The results show that small additions of Ti in AgCu braze alloys can decrease the final contact angle θF, but the Ti content increases from 2.0 wt % to 7.8 wt %, the contact angle θ changes little. The additions of Ti in AgCu can obviously increase the work of adhesion, as Ti content increase to 2.0 wt %, 4.0 wt % and 7.8 wt %, the increased work of adhesion is 1080 mJm−2 (ΔW1), 1083 mJm−2 (ΔW2) and 1083 mJm−2 (ΔW3), respectively. However，the little changes of the increased work of adhesion for enhancing Ti content in braze alloys are responsible for the tiny change of the final contact angle θF. The results also show that as the Ti content increases, the microstructures in the wetting drop zone change. As the Ti content increases to (4.0, 7.8) wt. %, Ti5Si3 compounds are formed in the wetting drop, which decrease the activity of Ti leading to the little change in spread rate.