Abstract
The structural stability of rapidly solidified (about 104 K/s) Sn–3.7Ag–0.9Zn eutectic solder was explored by high-temperature annealing. For the as-cast solders, the applied fast cooling rate had a significant influence on the microstructure of the solders. The faster the applied cooling rates, the smaller the β-Sn dendrites. After annealing at 473 K for 20 and 50 h, β-Sn dendrites congregated together into bulk ones for minimizing the interfacial energy, and Ag3Sn intermetallic compounds (IMCs) as well as ternary Ag–Zn–Sn IMCs segregated on the grain boundary of the β-Sn dendrites. It seems that the coarsening of the β-Sn dendrites in the rapidly solidified specimen brought a significant softening during annealing of the explored Sn–Ag–Zn alloy. Finally, the β-Sn dendrites vanished gradually with increase of the annealing period, which leads to a kind of softening.
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