Abstract
Intermetallic compounds (IMCs) formations of Sn/Cu reaction couple prepared by dip soldering were studied with isothermal aging at four levels of temperatures (120, 150, 170 and 200 °C, respectively). It is found that an obvious scallop-type layer of Cu6Sn5 IMC formed between the liquid Sn solder and Cu substrates and a planar Cu3Sn IMC layer between Cu6Sn5 IMC layer and Cu substrates appears after solid-state aging treatment. A significant increment of IMC layer thickness is observed with increasing aging time as well as aging temperature. And it is further found that the thickness of IMC layer is linearly related to the square root of aging time during the aging process. The values of growth rate constants for the different solid state aging temperatures (120, 150, 170 and 200 °C) were calculated as 6.578 × 10−18, 1.595 × 10−17, 9.89 × 10−17 and 4.521 × 10−16 m2 s−1, respectively. The apparent activation energy calculated for the growth of the total IMC is 84.43 kJ mol−1. Moreover, The mean diameters of the Cu6Sn5 grains increased linearly with cubic root of aging time.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callMore From: Journal of Materials Science: Materials in Electronics
Disclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
