Effects of the Si/Al layer thickness on the continuity, crystalline orientation and the growth kinetics of the poly-Si thin films formed by aluminum-induced crystallization

Abstract

The joint impact of the Si/Al layer thickness on the growth kinetics, the crystalline orientation and the size of the poly-Si grains resulting from aluminum-induced crystallization process is analyzed. It is shown that the surface coverage of resulting poly-Si layers rapidly decreases together with annealing temperature and the Si/Al ratio. The surplus of a-Si over the Al needed to ensure continuity of the poly-Si thin film is in the range of 35%–50% for Al layers thicker than 225nm, but rapidly goes up to 200% as the thickness of the Al layer decreases below 50nm. It is demonstrated that the angular distribution of grain orientations is discrete and shifts towards the {111} direction as the Si/Al increases. It is reported that during an isothermal annealing, the nucleation of Si grains occurs in two steps. Finally, a simple model of the aluminum-induced crystallization process explaining the two-step nucleation is proposed.