Abstract

We present a quantitative model for the efficiency of the molecular effect in damage buildup in semiconductors. Our model takes into account only one mechanism of the dependence of damage buildup efficiency on the density of collision cascades: nonlinear energy spikes. In our three-dimensional analysis, the volume of each individual collision cascade is divided into small cubic cells, and the number of cells that have an average density of displacements above some threshold value is calculated. We assume that such cells experience a catastrophic crystalline-to-amorphous phase transition, while defects in the cells with lower displacement densities have perfect annihilation. For the two limiting cases of heavy (500 keV/atom 209Bi) and light (40 keV/atom 14N) ion bombardment of Si, theory predictions are in good agreement with experimental data for a threshold displacement density of 4.5 at.%. For intermediate density cascades produced by small 2.1 keV/amu PF n clusters, we show that dynamic annealing processes entirely dominate cascade density effects for PF 2 ions, while energy spikes begin contributing in the case of PF 4 cluster bombardment.

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