Abstract
The effect of temperature/humidity treatment conditions on the interfacial adhesion energy between an electroless-plated Ni film and a polyimide substrate was evaluated by using a 180° peel test. The measured peel strength values decrease from 506.1 ±18.6 to 231.9 ±33.3 J/m2 due to the temperature/humidity treatment at 85 °C/85% relative humidity for 1000 h. X-ray photoelectron spectroscopy analysis of the peeled surfaces indicates that peeling occurs cohesively inside of the polyimide; this is related to both the decrease in the interfacial adhesion energy and the polyimide degradation when small quantities of the remaining alkali ions react with the polyimide's functional groups during the temperature/humidity treatment.
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