Abstract

The incorporation of both dopants and background impurities during the organometallic vapor phase epitaxial (OMVPE) growth of GaAs, GaInP, and GaP has been significantly altered by the use of the surfactants Sb and Bi. Sb and Bi are isoelectronic with the group V host elements, and so produce no independent doping. This paper demonstrates that the incorporation of Zn can be increased by an order of magnitude in GaP to a value of approximately 1020cm−3, the highest value reported to date. Additionally, these same surfactants lead to significant decreases in carbon contamination during growth. At high growth temperatures the reduction can be as large as 100× in GaP. The surfactants also result in marked decreases in autodoping due to S and Si from the substrate. A marker that may help identify the mechanism for these effects is H incorporation. Both Sb and Bi surfactants give rise to increased concentrations of H in the GaP layers. Similar effects are observed in GaInP. However, in GaAs, no H is detected in the layers. One possible explanation for these phenomena is that Sb or Bi increases the surface H concentration. The increased H would have two possible effects on the incorporation of dopants and impurities. (1) Passivation of the Zn acceptor by formation of a neutral Zn-H complex would lead to increased incorporation for thermodynamic reasons. (2) Allowing increased desorption of C, S, and Si from the surface by increased formation of volatile hydrides leads to decreased incorporation levels. These results suggest a simple and effective method of controlling the incorporation of dopant and impurity atoms by adding a minute amount of surfactant during OMVPE growth.

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