Abstract
Abstract This paper summarizes a study on the effect of changes in surface chemistry on the peel strength of copper/polymer interfaces. Two different surface topographics were created and evaluated, one produced by cleaning and etching in sodium persulfate, the other by etching then mechanically roughening using 180 grit sandpaper. Both surfaces were then oxidized in an alkaline/oxidizing treatment to form cupric oxide. Ion implantation and benzotriazole priming modified the surface chemistry of the cupric oxide samples. After lamination to form an epoxy/copper interface, peel strength measurements were taken. The results showed that ion implantation degraded the peel strength while priming with benzotriazole improved the peel strength compared with the unmodified cupric oxide. In a separate comparison study, peel strength measurements were taken on interfaces formed from copper oxides with the same oxide structure but with widely different gross morphologies, “As laminated” adhesive strength was virtuall...
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