Abstract
Thin Gallium Nitride (ThinGaN)-based light-emitting diodes (LEDs) demonstrate high extraction efficiency and brightness. Their slim designs make them appropriate for lighting applications that demand high luminous flux, small space, and stability. Thermal resistance and junction temperature values under different boundary conditions can help in understanding thermal management of ThinGaN-based LEDs. In this paper, thermal and optical characteristics of ThinGaN (UX:3) white LED mounted on Metal-Core Printed Circuit Board (MCPCB) and a SinkPad MCPCB are investigated. Thermal and optical parameters of the LED are measured by thermal transient tester (T3Ster) and spectrometer devices. Results show that the LED attached to the SinkPad MCPCB obtained lower thermal resistance and junction temperature than MCPCB.
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