Effects of Substrate and Annealing Temperatures on the Characteristics of SrBi4Ti4O15 Thin Films

Abstract

In this study, radio frequency (RF) sputtering was used as the method and the layer-structured bismuth compound of SrBi4Ti4O15 + 4 wt% Bi2O3 ferroelectric ceramic was used as the target to deposit the SrBi4Ti4O15 (SBT) thin films. The addition of excess Bi2O3 content in the target ceramic was used to compensate the vaporization of Bi2O3 during the sintering and deposition processes. SBT ferroelectric thin films were deposited on Pt/Ti/SiO2/Si under optimal RF magnetron sputtering parameters with different substrate temperatures for 2 h. After that the SBT thin films were post-heated using rapid temperature annealing (RTA) method. The dielectric and electrical characteristics of the SBT thin films were measured using metal-ferroelectric-metal (MFM) structure. From the physical and electrical measurements of X-ray diffraction pattern, scanning electronic microscope (SEM), I-V curve, and C-V curve, we had found that the substrate temperature and RTA-treated temperature had large influences on the morphology, the crystalline structure, the leakage current density, and the dielectric constant of the SBT thin films.