Effects of strain ratio and tensile hold time on low-cycle fatigue of lead-free Sn-3.5Ag-0.5Cu solder

Abstract

Low-cycle fatigue (LCF) behavior of a lead-free Sn-3.5Ag-0.5Cu solder alloy was investigated at various combinations of strain ratio (R = −1, 0, and 0.5) and tensile hold time (0, 10, and 100 sec). Results showed that the LCF life of the given solder, at each given combination of testing conditions, could be individually described by a Coffin-Manson relationship. An increase of strain ratio from R=−1 to 0 and to 0.5 would cause a significant reduction of LCF life due to a mean strain effect instead of mean stress effect. LCF life was also markedly reduced when the hold time at tensile peak strain was increased from 0 to 100 sec, as a result of additional creep damage generated during LCF loading. With consideration of the effects of strain ratio and tensile hold time, a unified LCF lifetime model was proposed and did an excellent job in describing the LCF lives for all given testing conditions.