Abstract

A microelectromechanical (MEMS) flux concentrator (J. Appl. phys. 91 (2002) 7795), is a device that will minimize 1/f noise in magnetic sensors by modulating the magnetic field at the position of the sensor. This requires high permeability and low stress permalloy (Py) films to be deposited on the MEMS flaps (J. Appl. phys. 91 (2002) 7795). Py (Ni80Fe20) films from 100 to 560nm thick were deposited on Si substrates using DC magnetron sputtering. The effects of deposition conditions on the grain morphology, texture, stress and magnetic properties were studied. Lower sputtering pressure changes film stress from tension to compression and increases the 〈111〉 out of film plane texture, while higher power increases tension and texture. Neutral film stress was obtained with 100W of sputtering power and 1.25mTorr of Ar gas pressure. With increasing thickness, the Py film was found to develop a stripe-like domain configuration at low fields because of strong out-of-plane magnetic anisotropy. The critical thickness is around 180nm.This may be explained by a competition between planar demagnetization fields and columnar magnetic anisotropy. Adding 5nm of Ta or Cr layer as spacer successfully broke up the continuity of the magnetic structure and allowed us to produce high-permeability films by fabricating (Ta/Py) or (Cr/Py) multilayer films with each Py layer thinner than the critical thickness.

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