Abstract

This paper focuses on the behavior of syntactic foam consisting of hollow glass microspheres embedded in an epoxy resin matrix. The hollow microspheres have wall thicknesses of 1 μm and a mean diameter of about 45 μm. Inserting microspheres in pure epoxy resin results in an increased viscosity of the liquid material during manufacturing process. In order to counteract this effect, SiO <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">2</sub> nanofillers are mixed to the liquid, uncured epoxy resin during the manufacturing process before the hollow microspheres are added. Viscosity measurements verify a significant reduction of the mixing viscosity up to 64 % by adding a small weight percentage (<; 5 wt.%) of nanofillers. Furthermore, the impact of the SiO <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">2</sub> nanofiller on the electrical, mechanical and thermal properties of syntactic foam is determined and discussed.

Full Text
Published version (Free)

Talk to us

Join us for a 30 min session where you can share your feedback and ask us any queries you have

Schedule a call