Abstract
Silver nanowires (AgNWs) are attracting much attention for their potential use in flexible or stretchable conducting film applications and in printed and wearable electronics devices. In this study, we fabricated flexible hybrid conducting films using different concentrations of composite silver ink prepared by mixing AgNW and silver nanoparticle (AgNP) materials, which we synthesized, for flexible interconnects and electrodes. These films had low resistivities at low sintering temperatures. Furthermore, they were also stable to tensile bending in comparison with a pure AgNP film. We found that there is an optimum concentration of AgNWs in the composite silver ink for the hybrid conducting film to have a lower resistivity even with sintering below 100 °C. We also found that the reason why hybrid conducting films are stable to repeated tensile bending is that AgNWs maintain functional conducting paths by making bridges that compensate for cracks between AgNPs during film bending.
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