Abstract

The effects of Si doping on the structural properties of a high-quality AlN layer grown on a trench-patterned AlN/sapphire by metalorganic vapor phase epitaxy (MOVPE) were systematically studied. With a high Si doping concentration, void formation became much slower than that in undoped AlN film. This phenomenon was attributed to the anti-surfactant effect of Si in the growth process. Moreover, as the Si doping concentration increased, compressive stress was significantly relaxed in Si-doped AlN films. A high Si doping concentration of 1×1018cm−3 was successfully achieved for AlN grown at 1500°C.

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