Abstract

The effects of the addition of Si on the temperature dependence of the electrical resistance and crystallization temperature, Tx, of GeTe films were investigated by a two-point probe measurement. Tx of the (GeTe)100−xSix films increased with increasing Si content from x = 0 (188 °C) to x = 12.6 at% (297 °C). It was confirmed from XPS measurements that Si–Te bonds were formed in the (GeTe)100−xSix amorphous film by the addition of Si. The dependence of Si content on the Tx of the (GeTe)100−xSix film was calculated based on Lankhorst's model, which showed a linear relationship between Tx and the Si content. In the region of low Si content (x ⩽ 3.8 at%), the obtained result was in good agreement with the calculated result. Meanwhile, in the region of high Si content (x ⩾ 5.4 at%), the obtained result considerably deviated from the calculated line. This may be due to the formation of the strongest Si–Si bonds in the amorphous (GeTe)100−xSix film. It was found from XRD measurement that the (GeTe)87.4Si12.6 amorphous film showed crystallization with phase separation into α-GeTe and Si. The obtained results suggested that suitable Si content of the (GeTe)100−xSix film is in the range 3–7 at% because of the high Tx, a small temperature interval of crystallization and the absence of phase separation during crystallization.

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