Effects of Selective Phosphoric Acid Etching on Enamel Using "No-wait" Self-etching Adhesives.

Abstract

To evaluate the effect of selective phosphoric acid etching on enamel using "no-wait" self-etching adhesives. Clearfil Universal Bond Quick (UBQ, Kuraray Noritake) or G-Premio BOND (GPB, GC) was applied to ground human enamel surfaces. The adhesives were used in 3 modes: no-waiting self-etching mode (UBQ-0 or GPB-0), 10-s self-etching mode (UBQ-10 or GPB-10), and the selective-etch mode with phosphoric acid etching (UBQ-PA or GPB-PA). After an acid-base challenge, the morphological attributes of the interface were examined using scanning electron microscopy (SEM) to characterize the acid-base resistant zone (ABRZ). Microshear bond strength (µSBS) testing to enamel and ultimate tensile strength (UTS) of the adhesive resin were carried out. ABRZ formation was confirmed in all groups. UBQ-PA and GPB-PA created thicker ABRZ with no funnel-shaped erosion beneath the adhesive-enamel interface. µSBS of UBQ-PA was significantly higher than UBQ-0 and UBQ-10 (p < 0.05). However, there were no statistically signficant differences in µSBS among GPB-0, GPB-10, and GPB-PA. For the UTS, UBQ was significantly higher than GPB. Selective phosphoric acid etching created a stable adhesive-enamel interface. The no-waiting self-etching concept adhesive led to a thinner ABRZ. The results of µSBS suggest that phosphoric acid etching effects on enamel are material dependent.