Abstract
In this study, the thermal stability and microstructural evolutions of nanotwinned copper (NT-Cu) films under thermal cycling are investigated. The microstructures and residual stresses were tuned by the electroplating current density. It was found that the thermal stability of the NT-Cu films decreased with an increase in current density. The texture transition from (111) to (100) suggests that the extremely anisotropic grain growth (EAGG) was driven by the minimization of strain energy. Bending beam technic was employed to measure the residual stress in the NT-Cu films. Large residual stress in the NT-Cu films is also considered a main driving force for the transition to the (100)-oriented texture. Additionally, strain energy, surface/interface energy, grain boundary energy, and twin boundary energy were calculated, and the results supported the experimental results.
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