Effects of Rapid Solidification Process and 0.1 wt.% Pr Addition on Properties of Sn-9Zn Alloy and Cu/Solder/Cu Joints

Abstract

Effects of 0.1 wt.% Pr addition and rapid solidification process on Sn-9Zn solder alloy were investigated. Solder characteristics of the as-solidified and rapidly solidified Sn-9Zn-0.1Pr alloys were analyzed in comparison with those of the as-solidified Sn-9Zn alloy. Mechanical properties and interfacial microstructure of solder/Cu joints obtained using these solders were comparatively studied. By comparison with the as-solidified Sn-9Zn alloy, the wettability of the solder was obviously improved with 0.1 wt.% Pr addition, and the melting behavior of the solder was promoted due to the rapid solidification process. The corrosion resistance of Sn-9Zn-0.1Pr alloy was improved due to the refined microstructure resulting from 0.1 wt.% Pr addition and rapid solidification. The growth of IMCs at the interface of Sn-9Zn-0.1Pr/Cu joints was depressed in some degree. Rapid solidification process promoted the interfacial reaction during soldering and improved the bonding strength of joints.