Abstract
Cu-11Ni-2W alloys have been prepared by vacuum non-consumable arc-melting and high-frequency induction melting injection moulding. The effects of melting processes on the resultant microstructure were studied. The results show that the grain of Cu-11Ni-2W alloy prepared by vacuum non-consumable arc-melting is coarse and the microstructure includes α solid solution and W particles. As for the sample prepared by high-frequency induction melting injection moulding, the grain is superfine and the microstructure is α solid solution. Moreover, the thermal conductivity coefficient for the sample prepared by vacuum non-consumable arc-melting is 67.2 W/(m•K), while that for high-frequency induction melting injection moulding is 47.8 W/(m•K). The melting point of Cu-11Ni-2W alloy prepared by vacuum non-consumable arc-melting is 1157.27°C.
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