Abstract

Effects of passivation on breakdown characteristics of normally-off InAlN/GaN MISHFETs have been investigated via physics based simulations. The product of passivation layer permittivity and thickness is found to dramatically affect breakdown voltage, due to alleviation of peak electric field at the gate edge on the drain side, leading to a much smoother field distribution in the channel. A proposed structure with a 985 nm TiO2 top and 15 nm HfO2 bottom passivation stack exhibits a breakdown at ∼750 V with leakage current ∼4 μA mm−1, showing ∼15× increase in breakdown voltage compared to the structure without the TiO2 top layer (50 V).

Full Text
Paper version not known

Talk to us

Join us for a 30 min session where you can share your feedback and ask us any queries you have

Schedule a call

Disclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.