Abstract
We investigate the effects of wall suction and injection on Chemical Vapour Deposition (CVD), a microfabrication process in which a gas mixture is pumped into a reactor and flows over a heated reactant porous surface to chemically deposit a thin film. Regular and cohesive film growth requires that laminar flow be maintained. The energy balance with wall suction for temperature dependence parameter $ϵ<0$ leads to increasing total mechanical energy due to reducing energy production and dissipation with increasing flow suction; for $ϵ>0$ there is a stabilization effect on the Tollmien-Schlichting waves mainly due to a large reduction in the energy contribution term.
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