Effects of oxygen doping on properties of microcrystalline silicon film grown using rapid thermal chemical vapor deposition

Abstract

An oxygen doped microcrystalline silicon (μc-Si) deposition process is developed by mixing small amounts of nitrous oxide (N2O) with silane (SiH4) in a rapid thermal chemical vapor deposition (RTCVD) reactor. The effects of oxygen doping on the properties of RTCVD μc-Si films are studied. Experimental results show that the RTCVD process provides high deposition rates for μc-Si and polycrystalline silicon (polySi) films at elevated deposition temperatures and pressures. The surface roughness of the RTCVD μc-Si films can be significantly reduced compared to that of conventional LPCVD polySi films. Steep side walls can be realized due to the small grain size of the μc-Si films. The sheet resistance of BF2 doped μc-Si films is slightly higher than that of BF2 doped polySi films, whereas sheet resistances of P and As doped μc-Si films are much higher than those of the corresponding P and As doped polySi films. Measurements of the catastrophic breakdown strength of metal-oxide-semiconductor (MOS) capacitors indicate that the quality of gate electrodes fabricated using μc-Si is improved relative to that of MOS capacitors fabricated using polySi gate electrodes.