Effects of oxidation and particle shape on critical volume fractions of silver‐coated copper powders in conductive adhesives for microelectronic applications

Abstract

AbstractThe effects of oxidation and particle shape on critical volume fractions of silver‐coated copper powders in conductive adhesives are investigated. Silver‐coated copper powders with spherical and flake‐shaped particles were oxidized at temperatures of 30°C, 175°C and 240°C for two hours and dispersed in an epoxy matrix. As silver‐coated copper powders are oxidized at 30°C and 175°C, the critical volume fractions of the conductive adhesives are slightly affected by oxidation and particle shape at these temperatures. As the oxidation temperature approaches 240°C, the critical volume fractions of the conductive adhesives are strongly affected by oxidation temperature and particle shape, owing to the formation of oxides such as Cu2O on the surface of silver‐coated copper powder—Cu diffuses from the interior to the surface of silver‐coated copper powder and reacts with the oxygen in the air. Silver‐coated copper powder with flake‐shaped particles shows lower critical volume fractions in conductive adhesives than silver‐coated copper powder with spherically shaped particles. Polym. Eng. Sci. 44:2075–2082, 2004. © 2004 Society of Plastics Engineers.