Abstract

Microchannel has been widely used in the microelectronics device because of the excellent heat transfer and low manufacturing cost. In this study, three kinds of microchannels including interlaced microchannel (IM), parallel microchannel (PM) and spiral microchannel (SM) were designed. The influences of microchannel configurations and hot/cold water parameters, such as flow rate and entrance temperature, on the thermal and hydraulic performances were studied. For IM, the heat could be transferred to the adjacent two cold water channels from the hot water channel, because the two side walls of the channel were served as the main heat transfer surfaces. The heat transfer area of IM was 6.4 and 8.4 times that of the PM and SM, respectively. The results showed that the heat transfer performance of IM was significantly enhanced without an obvious increase of pressure drop. The heat transfer performance was improved and the thermal resistance was reduced with the flow rate and entrance temperature of cold water. However, the flow rate and entrance temperature of hot water had little influence on the heat transfer performance. The IM exhibited an excellent thermal and hydraulic performance, and showed a good reliability and operation stability with a larger range of heat load.

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