Abstract
A low viscosity epoxy resin with carboxylic acid-based novel reductants was introduced to improve the process ability and reliability of an anisotropic conductive adhesive (ACA) resin with a low melting point alloy (LMPA) filler system. The curing degree of the ACA resin and the melting of the LMPA filler were investigated using differential scanning calorimetry (DSC) conducted in the dynamic mode in order to control the curing conditions such as the reaction temperature and a melting temperature of solder. The temperature-dependent viscosity characteristics of the ACA resin were investigated using a rheometer. The compatibility between the viscosity of a polymer matrix and a melting temperature of solder was characterized to optimize the processing cycle. Three different types of carboxyl acid-based reductants were added to remove the oxide layer on the surfaces of the filler particles and the conductive pad. Good wetting properties were achieved between the LMPA filler and the Cu pad in the epoxy resin using these carboxylic acid-based reductants.
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