Abstract
In this study, the effect of nano-silica (nano-SiO2) and boron carbide (B4C) on the curing behavior of the resole resin was evaluated using differential scanning calorimetry (DSC). For the curing behavior study, DSC analysis, carried out at different heating rates, was employed to evaluate the effect of fillers on heat generated during curing and evaporation of volatile components during the curing process. A kinetic model was suggested, and its parameters were determined. The results indicated that the existence of fillers in the resin decreased the evaporation heat of volatile components; meanwhile, the incorporation of the fumed silica increased the curing heat of the resin. Also the plot of reaction rate versus conversion showed that the curing kinetic of filled resin followed the autocatalytic mechanism because of the catalytic effects of water and hydroxyl groups on the surface of nano-silica particles. Model-plotting indicated the excellent agreement between experimental and model data.
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