Abstract
In this study, the effects of Cu nanoparticles on the melting characteristics, wettability, interfacial reaction and mechanical properties of [Formula: see text]–[Formula: see text] [Formula: see text], [Formula: see text], [Formula: see text], [Formula: see text], [Formula: see text], [Formula: see text] composite solders were investigated. Results show that the properties of the composite solder containing Cu nanoparticles were improved effectively. With the addition of Cu nanoparticles, the melting point of [Formula: see text]–[Formula: see text] solder decreased significantly, and the spreading area and the shear strength were increased by 10.3% and 23.2%, respectively. For the performance, the optimal addition of Cu nanoparticles was 0.7%. In addition, the growth of interfacial intermetallic compounds in [Formula: see text]–[Formula: see text] solder joints was inhibited by adding Cu nanoparticles.
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