Abstract
We report the effects of multiple reflow cycles on the reliability of Sn-Sb solders. Reflow soldering technology was used to prepare the Sn-Sb joints after 1 reflow cycle, 2 reflow cycles and 3 reflow cycles. We found that the intermetallic compound layers became thicker and denser with the reflow cycle increased. And the samples here had good bonding quality with only a few voids. After 600 thermal cycles, all three samples possessed stable microstructures and electrical properties. Such Sn-Sb solders have a potential application for the high-temperature packaging.
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