Abstract
A novel composite lead-free solder was prepared by adding Mo nanoparticles in Sn58Bi solder. Microstructure evolution of Sn58Bi-xMo(x = 0, 0.5%,1%)/Cu solder joints were investigated during aging process at different temperature. The results reveal that Mo nanoparticles significantly inhibited the growth of Cu6Sn5 compounds layer in solder joints, but had little influence on Cu3Sn compounds layer. The diffusion coefficients of atoms at different aging temperature were calculated. It was observed that several Cu6Sn5 compounds layer began to separate and diffuse into solder when Sn58Bi-0.5%Mo/Cu and Sn58Bi-1%Mo/Cu joints were aged for 240 h at 130 ℃. The influence mechanisms of Mo nanoparticles on the growth of Cu6Sn5 and Cu3Sn compounds were analyzed.
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