Abstract
Abstract The addition of microalloying elements improves the microstructure and properties of copper-based materials. In this study, WCu composites are synthesized in situ with Fe, Ni, or Mn as microalloying elements, and the effects of each element on the microstructural characteristics of the obtained composite are investigated. Fe, Ni, and Mn can be added in situ to WCu composites by thermite reduction. Increasing the temperature is not conducive to the reduction of MnO2 by Al. Ni, Fe, and Mn were well dissolved in the copper matrix, and their contents decreases in turn, while the Al content in the matrix increases in turn. Mn clearly reduces the size of tungsten particles, and the size reduction effect of the microalloying elements on tungsten particles follows the order Mn > Fe > Ni. The effect on the wettability of the interface follows the order Ni > Mn > Fe. Increasing the interfacial wetting is not conducive to the refinement of tungsten particles.
Highlights
Tungsten/copper (WCu) composites have the advantages of high density, high strength, high hardness, good electrical and thermal conductivity, and arc erosion resistance [1,2,3]
Fe2O3, NiO, and MnO2 can be reduced by Al in the Al–CuO–WO3 system to produce WCu composites microalloyed with Fe, Ni, and
These results indicate that the tungsten particles have a more uniform size when the microalloying element has a greater size reduction effect on tungsten particles
Summary
Tungsten/copper (WCu) composites have the advantages of high density, high strength, high hardness, good electrical and thermal conductivity, and arc erosion resistance [1,2,3] They are widely used in electrical contacts for high-voltage switches, resistance welding electrodes, aerospace rocket nozzles, etc. Johnson and Cao [16,17] researched the effect of Fe and Co on the properties of WCu alloys They found that a finite solid solution with Cu could be produced by adding small amounts of Fe and Co as activated elements during sintering, and the second phase can precipitate, producing intermetallic compounds at grain boundaries, which can
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