Abstract
Two types of ceramic-polymer composite thick films were deposited on Cu substrates by an aerosol deposition process, and their properties were investigated to fabricate optimized ceramic-based polymer composite thick films for application onto integrated substrates with the advantage of plasticity. When polymers with different mechanical properties, such as polyimide (PI) and poly(methyl methacrylate) (PMMA), are used as starting powders together with α-Al2O3 powder, two types of composite films are formed with different characteristics - surface morphologies, deposition rates, and crystallite size of α-Al2O3. Through the results of micro-Vickers hardness testing, it was confirmed that the mechanical properties of the polymer itself are associated with the performances of the ceramic-polymer composite films. To support and explain these results, the microstructures of the two types of polymer powders were observed after planetary milling and an additional modeling test was carried out. As a result, we could conclude that the PMMA powder is distorted by the impact of the Al2O3 powder, so that the resulting Al2O3-PMMA composite film had a very small amount of PMMA and a low deposition rate. In contrast, when using PI powder, the Al2O3-PI composite film had a high deposition rate due to the cracking of PI particles. Consequently, it was revealed that the mechanical properties of polymers have a considerable effect on the properties of the resulting ceramic-polymer composite thick films.
Highlights
Due to the continuous demand for the miniaturization and integration of electronic devices for ubiquitous and digital convergence, system-on-package (SOP) technology is emerging as an alternative concept to overcome the technological limits of conventional technologies, such as system-on-chip and system-in-package
Fabrication of Al2O3-Poly(methyl methacrylate) (PMMA) composite thick films Two types of polymer were used as the polymer starting powders in the fabrication of optimized ceramic-based polymer composite thick films by the aerosol deposition (AD) process
The Al2O3 and PMMA powders were prepared with the initial volume ratio of 70 vol.% and 30 vol.%
Summary
Due to the continuous demand for the miniaturization and integration of electronic devices for ubiquitous and digital convergence, system-on-package (SOP) technology is emerging as an alternative concept to overcome the technological limits of conventional technologies, such as system-on-chip and system-in-package. Ceramics are widely used for the integrated substrates since they have favorable characteristics, such as high reliability and good dielectric properties. Ceramics have a fundamental weakness in that they are fractured and require high-temperature processes for the fabrication of integrated substrates. To fabricate optimized ceramic-based polymer composite thick films by the AD process, it is necessary to understand how the mechanical properties of the starting powder affect the characteristics of the composite films. PMMA and PI are widely used as matrix components in composite films due to their good electrical, physical, and mechanical properties [8,9,10,11,12]. The tensile strength, fracture toughness, and elongation of PI are 75 to 90 MPa, 1.65 to 5.4 MPaÁm1/2, and 4% to 8%, respectively [13]
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