Abstract
Finite element method is carried out to calculate the fracture mechanics parameter of interfacial cracking of TSOP (Thin Small Outline Package). Fracture mechanics approach together with finite element results are used to study the impacts of material properties and thickness of die attach on the energy release rate at crack tip of interfacial delamination between die pad and die attach. The results show that larger Young’s modulus, smaller CTE as well thinner thickness of die attach can reduce ERR at crack tip during reflow.
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
