Effects of Interconnect Shape and Thermal-Electro-Migration on Solder Creep of Copper-Pillar Flip Chip Joints

Abstract

With the development of electronic products toward high density and high reliability, the size of interconnect solder joints and interconnect pitch continues to decrease. Under normal service conditions, solder joints are subjected to thermal–electric–mechanical loads simultaneously, resulting in reliability problems for many package structures. This article investigated the effects of interconnect shape and thermal-electro-migration on solder creep of copper-pillar flip chip joints and analyzed the corresponding failure modes and mechanisms. In this article, solder joints with different shapes were obtained by adjusting the thermal compression bonding process parameters, and creep experiments were performed on the solder joints under different temperature and stress conditions. In addition, we have performed thermoelectric coupling experiments and finite element simulations for different shapes of solder joints. Moreover, creep experiments were conducted on three types of solder joints after 10 and 40 h of thermoelectric coupling pretreatment. The results show that the three solder joints exhibit typical creep characteristics under different experimental conditions and the creep strain rate increases with the increase of shear stress and temperature. Under the same conditions, the creep strain rate of the hourglass-shaped solder joint is always higher than that of the other two solder joints. The electromigration reliability of the hourglass-shaped solder joint is the worst, and the electromigration reliability of the cylinder-shaped solder joint is the best. With the increase of thermoelectric coupling pretreatment time, the creep strain rate of solder joints increased significantly, and the fracture mode of solder joints gradually changed from ductile fracture to brittle fracture. Among the three types of solder joints, the creep resistance of the hourglass-shaped solder joints is greatly affected by the thermoelectric coupling pretreatment.