Abstract
Bulk In–Bi binary alloys with 50, 40, 33.7, and 30 mass% Bi and low melting temperatures were prepared and aged at 40 °C for 168, 504, and 1008 h in an oil bath. Tensile tests were performed on the bulk alloys, followed by fracture surface analysis of the tensile test samples. The effect of In content on the microstructures and mechanical properties of the alloys during thermal aging was analyzed. Ultimately, the tensile strength of the In–Bi alloys was found to decrease with aging time, while the elongation of the In–Bi alloys increased after thermal aging. The results of the tensile tests indicate that a higher In content improved the ductility of the In–Bi alloys significantly and reduced their strength. In addition, the fracture surfaces exhibited ductile fractures in the neck shapes. A comparative analysis of the microstructure and mechanical properties of the aforementioned alloys during thermal aging was also conducted.
Highlights
Modern electronic devices are smaller, lighter, thinner, and more energy-efficient than previous products [1,2], and flexible electronics are a representative technological innovation in the electronics industry
Previous studies have investigated the basic properties of In–Bi alloys, as well as their thermal and mechanical properties [17]. These studies found that the melting temperature of the In–Bi alloys decreased with increasing indium content
The XRD patterns of the In–Bi alloys shown in Figure 3a include BiIn2, Bi3 In5, and In-phase peaks
Summary
Modern electronic devices are smaller, lighter, thinner, and more energy-efficient than previous products [1,2], and flexible electronics are a representative technological innovation in the electronics industry. The temperature of the reflow process for regularly applying environmentally friendly Sn-based solder alloys is approximately 250 ◦ C [8], e.g., Sn–3.0Ag–0.5Cu (217 ◦ C) [9], Sn–3.5Ag (221 ◦ C) [10], and Sn–0.7Cu (227 ◦ C) [11] In this case, PP and PMMA are subject to thermal damage during the reflow process. Previous studies have investigated the basic properties of In–Bi alloys, as well as their thermal and mechanical properties [17] These studies found that the melting temperature of the In–Bi alloys decreased with increasing indium content. Sn–Ag–Cu alloy, a grain coarsening of the Sn-rich phase and coarsening of the Ag3 Sn intermetallic compounds (IMCs) was observed during thermal aging at 180 ◦ C Mechanical properties such as tensile strength and hardness decreased with the aging time [18]. In this study, we investigated the mechanical properties and microstructures of In–xBi alloys under isothermal aging to test and analyze their thermal reliability
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