Abstract

Journal of Polymer Science Part C: Polymer LettersVolume 28, Issue 11 p. 323-329 Article Effects of hydrostatic pressure on isothermal curing of an epoxy resin–amine system J. K. Lee, J. K. Lee High Pressure Materials Research Laboratory and Department of Mechanics and Materials Research Laboratory and Department of Mechanics and Materials Science, Rutgers University, Piscataway, NJ 08854-0909Search for more papers by this authorK. D. Pae, K. D. Pae High Pressure Materials Research Laboratory and Department of Mechanics and Materials Research Laboratory and Department of Mechanics and Materials Science, Rutgers University, Piscataway, NJ 08854-0909Search for more papers by this author J. K. Lee, J. K. Lee High Pressure Materials Research Laboratory and Department of Mechanics and Materials Research Laboratory and Department of Mechanics and Materials Science, Rutgers University, Piscataway, NJ 08854-0909Search for more papers by this authorK. D. Pae, K. D. Pae High Pressure Materials Research Laboratory and Department of Mechanics and Materials Research Laboratory and Department of Mechanics and Materials Science, Rutgers University, Piscataway, NJ 08854-0909Search for more papers by this author First published: October 1990 https://doi.org/10.1002/pol.1990.140281102Citations: 3AboutPDF ToolsRequest permissionExport citationAdd to favoritesTrack citation ShareShare Give accessShare full text accessShare full-text accessPlease review our Terms and Conditions of Use and check box below to share full-text version of article.I have read and accept the Wiley Online Library Terms and Conditions of UseShareable LinkUse the link below to share a full-text version of this article with your friends and colleagues. Learn more.Copy URL Share a linkShare onFacebookTwitterLinked InRedditWechat Citing Literature Volume28, Issue11October 1990Pages 323-329 RelatedInformation

Full Text
Published version (Free)

Talk to us

Join us for a 30 min session where you can share your feedback and ask us any queries you have

Schedule a call