Abstract
We report that the resistivity of SiGe films deposited on a B-doped Si substrate by solid-source molecular beam epitaxy (MBE) is reduced by postgrowth hydrogen treatment and the subsequent annealing. This effect was observed near a bevel surface finished by mechanical polishing. Therefore, the damaged surface layer played an important role in this effect. The same reduction in the resistivity of the SiGe films was also observed by intentional supplying hydrogen during film deposition. These phenomena indicate that hydrogen assists the electrical activation of boron.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
